MOUNTING DEVICE AND METHOD FOR MANUFACTURING ELECT

专利名称：MOUNTING DEVICE AND METHOD FOR

MANUFACTURING ELECTRONIC MODULE

发明人：Kazunori HAMAZAKI申请号：US13470349申请日：20120513

公开号：US20120222808A1公开日：20120906

专利附图：

摘要：To mount electronic components with different types of electrodes en masseon a substrate, the present invention comprises a heating section that heats an electrodeof a first electronic component and an electrode of a second electronic component

among the plurality of electronic components; a heat releasing section that releases heatfrom the electrode of the first electronic component and the electrode of the secondelectronic component; a first thermally conductive member disposed between theelectrode of the first electronic component and the heating section or the heat releasingsection; and a second thermally conductive member disposed between the electrode ofthe second electronic component and the heating section or the heat releasing section.The first thermally conductive member and the second thermally conductive memberhave different amounts of heat transfer per unit time.

申请人：Kazunori HAMAZAKI

地址：Tochigi JP

国籍：JP

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