INTEGRATED CIRCUIT DEVICE ASSEMBLY

专利名称：INTEGRATED CIRCUIT DEVICE ASSEMBLY发明人：David Barron,Jason R. Eagle,Roger D.

Hamilton,Mark K. Hoffmeyer,Christopher W.Mann,Matthew T. Richardson

申请号：US149271申请日：20160106

公开号：US20170196075A1公开日：20170706

专利附图：

摘要：A method for assembling an integrated circuit device includes positioning athermal interface material (TIM) on top of an electronic component, positioning a load

frame onto a printed circuit board, the load frame having an open region for theelectronic component to extend through, and positioning a heat sink onto the TIM. Themethod further comprises fastening a first screw fastener, resulting in a TIM bond linebetween the heat sink and the electronic component, and actuating a second screwfastener disposed within a bore of the heat sink and threaded into the load frame. Thesecond screw fastener, upon being tightened expands radially to lock the heat sink intothe load frame. The first screw fastener, upon the tightening of the second screwfastener, connects the heat sink and the load frame to the printed circuit board.

申请人：International Business Machines Corporation

地址：Armonk NY US

国籍：US

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