Method of mounting a circuit component and joint s

专利名称：Method of mounting a circuit component

and joint structure therefor

发明人：Charles T. Eytcheson申请号：US098815申请日：20010614公开号：US06822331B2公开日：20041123

专利附图：

摘要：A joint structure and method for bonding together two components, such aswhen attaching an electrical circuit element to a conductor on a substrate. The jointstructure comprises a mesh infiltrated by a solder material, in which the mesh is

preferably formed of a material having a higher thermal conductivity than the soldermaterial. The joint structure is able to offer improvements in thermal conductivity,electrical conductivity, reflow processing, and stress distribution between the structuresit connects. Each of these attributes of the joint structure can be tailored to some degreeby the choices of materials for the mesh and the solder material.

申请人：DELPHI TECHNOLOGIES, INC.

代理人：Stefan V. Chmielewski

更多信息请下载全文后查看