WH1602A-YYH-ET_Winstar

華凌光電股份有限公司

SPECIFICATION

CUSTOMER : MODULE NO.:

WH1602A-YYH-ET#

APPROVED BY:

( FOR CUSTOMER USE ONLY )

PCB VERSION: DATA:

SALES BY APPROVED BY CHECKED BY PREPARED BY

ISSUED DATE:

第 1 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/Winstar Display Co., LTD MODLE NO： 華凌光電股份有限公司 RECORDS OF REVISION

REVISEDPAGE NO.

VERSION DATE DOC. FIRST ISSUE

SUMMARY

0 2006-11-2 First issue

第 2 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/Contents

1.Module Classification Information 2.Precautions in use of LCD Modules 3.General Specification 4.Absolute Maximum Ratings 5.Electrical Characteristics 6.Optical Characteristics 7.Interface Pin Function

8.Contour Drawing & Block Diagram 9.Function Description

10.Character Generator ROM Pattern 11.Instruction Table 12.Timing Characteristics 13.Initializing of LCM 14.Reliability

15.Backlight Information

16. Inspection specification

17. Material List of Components for RoHs

第 3 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/1.Module Classification Information W H 1 6 0 2 A－Y Y H－ ET# c d e f g h i j

c Brand：WINSTAR DISPLAY CORPORATION

d Display Type：H→Character Type, G→Graphic Type e Display Font：Character 16 words, 2Lines. f Model serials no.

g

Backlight Type： N→Without backlight T→LED, White

B→EL, Blue green A→LED, Amber D→EL, Green R→LED, Red W→EL, White O→LED, Orange F→CCFL, White G→LED, Green Y→LED, Yellow Green B→LED, Blue

h LCD Mode： B→TN Positive, Gray T→FSTN Negative

N→TN Negative,

G→STN Positive, Gray

Y→STN Positive, Yellow Green M→STN Negative, Blue F→FSTN Positive

i LCD Polarize A→Reflective, N.T, 6:00 H→Transflective, W.T,6:00

Type/ Temperature range/ View D→Reflective, N.T, 12:00 K→Transflective, W.T,12:00 direction G→Reflective, W. T, 6:00 C→Transmissive, N.T,6:00 J→Reflective, W. T, 12:00 F→Transmissive, N.T,12:00

B→Transflective, N.T,6:00 I→Transmissive, W. T, 6:00 E→Transflective, N.T.12:00 L→Transmissive, W.T,12:00 j Special Code ET : English and European standard font ;

#:Fit in with the ROHS Directions and regulations

第 4 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/2.Precautions in use of LCD Modules (1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of LCD module.

(3)Don’t disassemble the LCM.

(4)Don’t operate it above the absolute maximum rating. (5)Don’t drop, bend or twist LCM. (6)Soldering: only to the I/O terminals.

(7)Storage: please storage in anti-static electricity container and clean environment.

3.General Specification Item Dimension Unit Number of Characters Module dimension View area Active area Dot size Dot pitch Character size Character pitch LCD type View direction Backlight Type

第 5 頁，共 28 頁

16 characters x 2 Lines 84.0 x 44.0 x 13.2(MAX)

66.0 x 16.0 56.20 x 11.5 0.55 x 0.65 0.60 x 0.70 2.95 x 5.55 3.55 x 5.95

STN Positive, Transflective, Yellow Green 6 o’clock LED Yellow green

－ mm mm mm mm mm mm mm

Duty 1/16 Free Datasheet http://www.datasheet4u.com/4.Absolute Maximum Ratings Item Symbol Min Typ Max Unit Operating Temperature Storage Temperature Input Voltage

Supply Voltage For Logic Supply Voltage For LCD

TOPTSTVIVDD-VSSVDD-V0

-20 -30 VSS-0.3 -0.3

－ － － － －

+70 +80 VDD

℃ ℃ V

7 V 13 V 5.Electrical Characteristics Item

Supply Voltage For Logic

Supply Voltage For LCD

Input High Volt. Input Low Volt. Output High Volt. Output Low Volt. Supply Current

第 6 頁，共 28 頁

Symbol Condition Min Typ Max Unit VDD-VSS

－ Ta=-20℃

VDD-V0

Ta=25℃ Ta=70℃

VIHVILVOHVOLIDD

－ － － －

4.5 5.0 5.5 V － － 3.2 0.7 VDDVSS3.9 －

－ 3.8 － － － － －

5.2 － － VDD

V V V V

0.6 V －

V

0.4 V VDD=5.0V 1.0 1.2 1.5 mA Free Datasheet http://www.datasheet4u.com/6.Optical Characteristics Item Symbol Condition Min Typ Max Unit (V)θ CR≧2

View Angle Contrast Ratio Response Time

(H)φ CR≧2 CR T rise T fall

－ － －

20 -30 － － －

－ － 3

40 deg 30 deg －

－

150 200 ms 150 200 ms Definition of Operation Voltage (Vop) Definition of Response Time ( Tr , Tf )

Intensity100％Selected WaveNon-selectedConitionIntensitySelected ConitionNon-selectedConitionNon-selected Wave10％Cr MaxCr = Lon / Loff100％90％VopDriving Voltage(V)TrTf[positive type] [positive type] Conditions : Operating Voltage : Vop Frame Frequency : 64 HZ Viewing Angle(θ，φ) : 0°， 0° Driving Waveform : 1/N duty , 1/a bias Definition of viewing angle(CR≧2) θbθfφ= 180°θlθrφ= 270°φ= 90° φ= 0°第 7 頁，共 28 頁 Free Datasheet http://www.datasheet4u.com/7.Interface Pin Function Pin No. Symbol 1 VSS2 VDD3 4

VO RS

Level

0V Ground 5.0V H/L

Supply Voltage for logic H: DATA, L: Instruction code

(Variable) Operating voltage for LCD

Description

5 R/W H/L H: Read(MPU→Module) L: Write(MPU→Module) 6 E H,H→L Chip enable signal 7 8 9 10 11 12 13 14

DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7

H/L H/L H/L H/L H/L H/L H/L H/L

Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line LED +

15 A －

16 K － LED－

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Free Datasheet http://www.datasheet4u.com/8.Contour Drawing &Block Diagram

第 9 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/9.Function Description The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an instruction register (IR) and a data register (DR).

The IR stores instruction codes, such as display clear and cursor shift, and address information for display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM. By the register selector (RS) signal, these two registers can be selected.

RS R/W Operation

0 0 1 1

Busy Flag (BF)

When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction must be written after ensuring that the busy flag is 0.

Address Counter (AC)

The address counter (AC) assigns addresses to both DDRAM and CGRAM

Display Data RAM (DDRAM)

This DDRAM is used to store the display data represented in 8-bit character codes. Its extended capacity is 80×8 bits or 80 characters. Below figure is the relationships between DDRAM addresses and positions on the liquid crystal display. AC (hexadecimal)

High bits Low bitsExample: DDRAM addresses 4EAC6 AC5 AC4 AC3AC2AC1AC0 100 1 1 100 1 0 1

IR write as an internal operation (display clear, etc.) Read busy flag (DB7) and address counter (DB0 to DB7) Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM) Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)

第 10 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/

Display position DDRAM address

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

00 01 02 03 04 05 06 0708090A0B0C0D0E 0F 40 41 42 43 44 45 46 4748494A4B4C4D4E 4F 2-Line by 16-Character Display

Character Generator ROM (CGROM)

The CGROM generate 5×8 dot or 5×10 dot character patterns from 8-bit character codes. See Table 2.

Character Generator RAM (CGRAM)

In CGRAM, the user can rewrite character by program. For 5×8 dots, eight character patterns can be written, and for 5×10 dots, four character patterns can be written.

Write into DDRAM the character code at the addresses shown as the left column of table 1. To show the character patterns stored in CGRAM.

第 11 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/ Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns

Table 1.

For 5 * 8 dot character patternsCharacter Codes(DDRAMdata)76543210CGRAMAddress5432100101010101010101010101Character Patterns( CGRAM data )7*****************654321000000000000000000000Characterpattern( 2 )Cursor patternCharacterpattern( 1 )Cursor patternHigh Low0000*0000000*001High Low00000101000101011110000010100110101111000011111110011High Low****00**00****0**00**00**000**00**00****00****00**00**000**0000*111***For 5 * 10 dot character patternsCharacter Codes(DDRAMdata)76543210CGRAMAddress543000000001111200001111000110011001100110010101010101Character Patterns( CGRAM data )7************6************543000000000*2000000000*1000000000*00000*0000High LowHigh LowHigh Low*0*0*********0**0000*00000CharacterpatternCursor pattern: \" High \"

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Free Datasheet http://www.datasheet4u.com/10.Character Generator ROM Pattern Table.2

Upper4 bitLower4 bitLLLLLLLHLLHLLLHHLHLLLHLHLHHLLHHHHLLLHLLHHLHLHLHHHHLLHHLHHHHLHHHHLLLL CGRAM ( 1 ) CGRAM ( 2 ) CGRAM ( 3 ) CGRAM ( 4 ) CGRAM ( 5 ) CGRAM ( 6 ) CGRAM ( 7 ) CGRAM ( 8 ) CGRAM ( 1 ) CGRAM ( 2 ) CGRAM ( 3 ) CGRAM ( 4 ) CGRAM ( 5 ) CGRAM ( 6 ) CGRAM ( 7 ) CGRAM ( 8 )LLLHLLHLLLHHLHLLLHLHLHHLLHHHHLLLHLLHHLHLHLHHHHLLHHLHHHHLHHHH 第 13 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/11.Instruction TableInstruction Code

Instruction

RS R/W DB7DB6 DB5 DB4DB3DB2DB1DB0

Clear Display 0 0 0 0 0 0 00

0

1

Write “00H” to DDRAM and set

DDRAM address to “00H” from AC Set DDRAM address to “00H” from AC and return cursor to its original position if shifted. The contents of DDRAM are not changed.

Assign cursor moving direction and enable the shift of entire display. Set display (D), cursor (C), and blinking of cursor (B) on/off control bit. Set cursor moving and display shift control bit, and the direction, without changing of DDRAM data.

Set interface data length

(DL:8-bit/4-bit), numbers of display line (N:2-line/1-line)and, display font type (F:5×11 dots/5×8 dots)

Execution time (fosc=270Khz)

Description

1.53ms

Return Home 0 0 0 0 0 0 0Entry Mode Set Display ON/OFF Control Cursor or Display Shift

01

－

1.53ms

0 0 0 0 0 0 00 0 0 0 0 0 11D

I/DC

SHB

39μs 39μs

0 0 0 0 0 1 S/CR/L

－－39μs

Function Set 0 0 0 0 1 DL NSet CGRAM

Address Set DDRAM Address Read Busy Flag and Address Write Data to RAM Read Data from RAM

F

－－39μs

0 0 0 1 AC5 AC4AC3AC2AC1AC0Set CGRAM address in address counter. 0 0 1 AC6 AC5 AC4AC3AC2AC1AC0Set DDRAM address in address counter.

Whether during internal operation or not

can be known by reading BF. The

AC6 AC5 AC4AC3AC2AC1AC0

contents of address counter can also be read.

39μs 39μs

0 1 BF

0μs

1 0 D71 1 D7

D6 D5 D4 D3D6 D5 D4 D3D2D2

D1D1

D0D0

Write data into internal RAM

(DDRAM/CGRAM). Read data from internal RAM (DDRAM/CGRAM).

43μs 43μs

＊ ”－”：don’t care

第 14 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/12.Timing Characteristics 12.1 Write Operation

Ta=25℃, VDD=5.0V

Item SymbolEnable cycle time Enable pulse width Enable rise/fall time

Address set-up time (RS, R/W to E) Address hold time Data set-up time Data hold time

TCTPW TR,TF tAStAHtDSWtH

Min Typ Max Unit 1200 140 － 0 10 40 10

－ － － － － － －

－ －

ns ns

25 ns － － － －

ns ns ns ns

第 15 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/12.2 Read Operation

Ta=25℃, VDD=5V

Item SymbolEnable cycle time

Enable pulse width (high level) Enable rise/fall time

Address set-up time (RS, R/W to E) Address hold time Data delay time Data hold time

TCTPW TR,TF tAStAHtDDRtH

Min Typ Max Unit 1200 140 － 0 10 － 10

－ － － － － － －

－ －

ns ns

25 ns － －

ns ns

100 ns －

ns

第 16 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/13.Initializing of LCM Power onWait for more than 40 ms after VDD rises to 4.5 VBF can not be checked before this instruction.RSR/WDB7DB6DB5DB4DB3DB2DB1DB0Function set 00110****0Wait for more than 39usBF can not be checked before this instruction.RSR/WDB7DB6DB5DB4DB3DB2DB1DB00010****00NF*0*****0Wait for more than 39 µsFunction set RSR/WDB7DB6DB5DB4DB3DB2DB1DB0***Function set 010*000***0NF***0Wait for more than 37usBF can not be checked before this instruction.RSR/WDB7DB6DB5DB4DB3DB2DB1DB0Display ON/OFF control00*000***00*1DCB***0Wait for more than 37 µsRSR/WDB7DB6DB5DB4DB3DB2DB1DB0 Display Clear 000*00***00001****00Wait for more than 1.53msRSR/WDB7DB6DB5DB4DB3DB2DB1DB0Entry Mode Set 000***00*0***0100I/DSH*Initialization ends4-Bit Ineterface第 17 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/Power onWait for more than 40 ms after VDD rises to 4.5 VBF can not be checked before this instruction.RSR/WDB7DB6DB5DB4DB3DB2DB1DB0Function set 000011NF**Wait for more than 39usBF can not be checked before this instruction.RSR/WDB7DB6DB5DB4DB3DB2DB1DB0Function set 000011NF**Wait for more than 37usRSR/WDB7DB6DB5DB4DB3DB2DB1DB0Display ON/OFF control0000001BCDWait for more than 37 µsRSR/WDB7DB6DB5DB4DB3DB2DB1DB0 Display Clear 0000000001Wait for more than 1.53msRSR/WDB7DB6DB5DB4DB3DB2DB1DB0Entry Mode Set 00000001I/DSInitialization ends8-Bit Ineterface

第 18 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/14.Reliability Content of Reliability Test (wide temperature, -20℃~70℃)

Environmental Test Test Item High Temperature storage Low Temperature storage Content of Test Test Condition 80℃ Endurance test applying the high storage temperature for a long time. 200hrs -30℃ Endurance test applying the high storage temperature for a long time. 200hrs Endurance test applying the electric stress 70℃ High Temperature (Voltage & Current) and the thermal stress to the Operation 200hrs element for a long time. Low Temperature Endurance test applying the electric stress under -20℃ Operation low temperature for a long time. 200hrs The module should be allowed to stand at 60℃,90%RH max High Temperature/ For 96hrs under no-load condition excluding the 60℃,90%RH Humidity Operation polarizer, 96hrs Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20℃/70℃ -20℃ 25℃ 70℃ Thermal shock resistance 10 cycles 30min 5min 30min 1 cycle Total fixed amplitude : 1.5mm Vibration Endurance test applying the vibration during Frequency : 10~55HzVibration test One cycle 60 seconds transportation and using. to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS=1.5kΩEndurance test applying the electric stress to the Static electricity test CS=100pF terminal. 1 time Note 2 1,2 —— 1 1,2 —— 3 —— Note1: No dew condensation to be observed.

Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber.

Note3: Vibration test will be conducted to the product itself without putting it in a container.

第 19 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/15.Backlight Information Specification

PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION Supply Current ILED 104 130 150 mA V=4.2V Supply Voltage V Reverse Voltage Luminous Intensity Wave Length Life Time

VR

4.0 4.2 4.4 V － －

－

－ 8 V CD/M2ILED=130mA

－ IV 135 195 λp －

560 570 580 nm ILED=130mA －

100000－

Hr.

ILED≦130mA

Color Yellow Green

Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum).

第 20 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/16. Inspection specification

NO Item Criterion

1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character , dot or icon. 1.3 Display malfunction.

Electrical 1.4 No function or no display.

01

1.5 Current consumption exceeds product specifications. Testing

1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect.

Black or white 2.1 White and black spots on display ≦0.25mm, no more than 02 spots on LCD three white or black spots present.

(display only) 2.2 Densely spaced: No more than two spots or lines within 3mm

3.1 Round type : As following drawing Φ=( x + y ) / 2 SIZE Acceptable Q TY

Φ≦0.10Accept no dense0.10＜Φ≦0.202 0.20＜Φ≦0.251 0.25＜Φ 0

AQL

0.65

2.5

2.5

03

LCD black

spots, white spots, contamination

3.2 Line type : (As following drawing)

(non-display)

LengthWidth Acceptable Q TY--- W≦0.02 Accept no dense

2.5 L≦3.00.02＜W≦0.03

2 L≦2.50.03＜W≦0.05

--- 0.05＜W As round type

If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction.

04

Polarizer bubbles

Size Φ Φ≦0.20 0.20＜Φ≦0.50 0.50＜Φ≦1.00 1.00＜Φ

Total Q TY Acceptable Q TYAccept no dense

3 2 0 3

2.5

第 21 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/

NO Item Criterion

05 Scratches Follow NO.3 LCD black spots, white spots, contamination

AQL

Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length:

6.1 General glass chip :

6.1.1 Chip on panel surface and crack between panels:

06

Chipped glass

z: Chip thickness y: Chip width x: Chip length

Z≦1/2t Not over viewing areax≦1/8a 1/2t＜z≦2t Not exceed 1/3k x≦1/8a ☉If there are 2 or more chips, x is total length of each chip.

6.1.2 Corner crack:

2.5

z: Chip thickness y: Chip width x: Chip length

Z≦1/2t Not over viewing areax≦1/8a 1/2t＜z≦2t Not exceed 1/3k x≦1/8a ☉If there are 2 or more chips, x is the total length of each chip.

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Free Datasheet http://www.datasheet4u.com/

NO Item Criterion

AQL

Symbols :

x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length

6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad :

y: Chip width x: Chip length y≦0.5mm x≦1/8a 6.2.2 Non-conductive portion:

z: Chip thickness 0 ＜ z ≦ t

06

Glass crack

2.5

y: Chip width x: Chip length z: Chip thickness y≦ L x≦1/8a 0 ＜ z ≦ t

☉If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. ☉If the product will be heat sealed by the customer, the alignment mark not be damaged.

6.2.3 Substrate protuberance and internal crack.

y: width y≦1/3L

x: length x ≦ a

第 23 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/

NO Item Criterion AQL2.5 0.652.5 0.65The LCD with extensive crack is not acceptable. 07 Cracked glass 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using Backlight 08 elements LCD spot, lines and contamination standards. 8.3 Backlight doesn＇t light or color wrong. 9.1 Bezel may not have rust, be deformed or have fingerprints, 09 Bezel stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10 PCB、COB 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB X 2.5 0.65 2.5 2.5 0.65 2.5 2.5 0.65 0.65 2.5 2.5 Y X * Y<=2mm2 2.5 2.5 2.5 0.65 11.1 No un-melted solder paste may be present on the PCB. 11.2 No cold solder joints, missing solder connections, oxidation or 11 Soldering icicle. 11.3 No residue or solder balls on PCB. 11.4 No short circuits in components on PCB.

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Free Datasheet http://www.datasheet4u.com/

NO Item Criterion

12.1 No oxidation, contamination, curves or, bends on interface Pin

(OLB) of TCP.

12.2 No cracks on interface pin (OLB) of TCP.

12.3 No contamination, solder residue or solder balls on product. 12.4 The IC on the TCP may not be damaged, circuits.

12.5 The uppermost edge of the protective strip on the interface pin

must be present or look as if it cause the interface pin to sever. 12.6 The residual rosin or tin oil of soldering (component or chip General

12

appearance component) is not burned into brown or black color.

12.7 Sealant on top of the ITO circuit has not hardened. 12.8 Pin type must match type in specification sheet. 12.9 LCD pin loose or missing pins.

12.10 Product packaging must the same as specified on packaging

specification sheet.

12.11 Product dimension and structure must conform to product

specification sheet.

第 25 頁，共 28 頁

AQL 2.5 0.652.5 2.5 2.5 2.5 2.5 0.650.650.65 0.65

Free Datasheet http://www.datasheet4u.com/17. Material List of Components for RoHs

1. WINSTAR Display Co., Ltd hereby declares that all of or part of products (with the mark “#”in code), including, but not limited to, the LCM, accessories or packages, manufactured and/or delivered to your company (including your subsidiaries and affiliated company)

directly or indirectly by our company (including our subsidiaries or affiliated companies) do not intentionally contain any of the substances listed in all applicable EU directives and regulations, including the following substances.

Exhibit A：The Harmful Material List .

Material (Cd) Limited Value

100 ppm

(Pb) 1000 ppm

(Hg) 1000 ppm

(Cr6+) PBBs 1000 ppm

1000 ppm

PBDEs 1000 ppm

Above limited value is set up according to RoHS.

2.Process for RoHS requirement：

(1) Use the Sn/Ag/Cu soldering surface；the surface of Pb-free solder is rougher than we used before. (2) Heat-resistance temp.：

Reflow：250℃,30 seconds Max.；

Connector soldering wave or hand soldering：320℃, 10 seconds max. (3) Temp. curve of reflow, max. Temp.：235±5℃；

Recommended customer’s soldering temp. of connector：280℃, 3 seconds.

第 26 頁，共 28 頁

Free Datasheet http://www.datasheet4u.com/winstar LCM Sample Estimate Feedback Sheet Module Number： Page: 1

1、Panel Specification： 1. Panel Type：

2. View Direction： 3. Numbers of Dots： 4. View Area： 5. Active Area：

6. Operating Temperature： 7. Storage Temperature：

□ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass

□ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG ,

8. Others： 2、Mechanical Specification：

□ Pass 1. PCB Size：

2. Frame Size： 3. Materal of Frame： 4. Connector Position： 5. Fix Hole Position： 6. Backlight Position： 7. Thickness of PCB： 9. Height of Module： 10. Others：

□ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass

□ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , 8. Height of Frame to PCB： □ Pass

3、Relative Hole Size：

1. Pitch of Connector： 2. Hole size of Connector： 3. Mounting Hole size： 4. Mounting Hole Type： 5. Others：

4、Backlight Specification： 1. B/L Type： 2. B/L Color：

4. B/L Driving Current： 5. Brightness of B/L： 6. B/L Solder Method： 7. Others：

第 27 頁，共 28 頁

3. B/L Driving Voltage (Reference for LED Type)： □ Pass

＞＞ Go to page 2 ＜＜

Free Datasheet http://www.datasheet4u.com/

winstar

Module Number： Page: 2

5、Electronic Characteristics of Module：

□ Pass 1. Input Voltage：

2. Supply Current： 3. Driving Voltage for LCD： 4. Contrast for LCD： 5. B/L Driving Method： 6. Negative Voltage Output： 7. Interface Function： 8. LCD Uniformity： 9. ESD test： 10. Others：

□ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass

□ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , 6、Summary：

Sales signature：

Customer Signature： Date： / /

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