METHOD AND APPARATUS FOR REFLOW SOLDERING

专利名称：METHOD AND APPARATUS FOR REFLOW

SOLDERING

发明人：Kevin Stephen Davies申请号：US13139025申请日：20091210

公开号：US20110248074A1公开日：20111013

专利附图：

摘要：Reflow soldering apparatus comprising a vapour chamber in communicationwith a reservoir of heat transfer fluid such that a volume of vaporised heat transfer fluidis created and held in the vapour chamber by heating of the heat transfer fluid. A heating

chamber is provided for receiving a board and a transportation mechanism is provided totransport vapour, and condensate formed from the vapour, from the volume ofvaporised heat transfer fluid to the heating chamber. The transported vapour andcondensate applies heat to the heating chamber for the reflow soldering process.

申请人：Kevin Stephen Davies

地址：Duncraig AU

国籍：AU

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