Method and device for controlling interior fractur

专利名称：Method and device for controlling interior

fractures by controlling the laser pulsewidth

发明人：Ryuji Sugiura申请号：US13262995申请日：20100329公开号：US09035216B2公开日：20150519

专利附图：

摘要：A laser processing device () comprises a laser light source () for emitting a laserlight (L) and a laser light source controller () for controlling the pulse width of the laser

light (L) and irradiates an object to be processed () with the laser light (L) while locating aconverging point (P) within the object (), so as to form a modified region along a line tocut () of the object () and generate a fracture extending in a thickness direction of theobject () from the modified region as the modified region is formed. In the laserprocessing device (), the laser light source controller () changes the pulse width of thelaser light (L) according to a data table in which the fracture length, the thickness of theobject (), and the pulse width of the laser light (L) are associated with each other. That is,the pulse width is changed according to the fracture length generated from the modifiedregion. Therefore, the laser processing device () can generate a fracture having adesirable length from the modified region.

申请人：Ryuji Sugiura

地址：Hamamatsu JP

国籍：JP

代理机构：Drinker Biddle & Reath LLP

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