专利名称:METHOD AND DEVICE FOR PARTICLE
MEASUREMENT
发明人:TSUKAMOTO, Keizo,TONA,
Masahide,MISAIZU, Fuminori,KOYASU,Kiichirou
申请号:EP15833903.6申请日:20150807公开号:EP31846A4公开日:20180418
摘要:Provided are a method and a device that can measure sputtered particlesdischarged by sputtering with high precision within a short time. A measuring device has ameasuring section that measures a ratio between an equivalent value of the number ofion particles discharged from a target by sputtering caused by a pulsed electric
discharge and an equivalent value of the number of neutral particles discharged from thetarget by the pulsed electric discharge. The ratio between the number of the ionparticles and the number of the neutral particles discharged from the target by thesputtering can be regarded as one of factors affecting quality of a vapor-deposited film,a film growth rate and an etching rate. Thus, a factor affecting the quality of the vapor-deposited film, the film growth rate and the etching rate can be grasped and alsocontrolled.
申请人:Ayabo Corporation,Tohoku University
地址:1 Hosogute Fukama-cho Anjo-shi, Aichi 446-0052 JP,2-1-1, Katahira Aoba-kuSendai-shi, Miyagi 980-8577 JP
国籍:JP,JP
代理机构:Garavelli, Paolo
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