Heat dissipation device for a computer

专利名称：Heat dissipation device for a computer发明人：Sen Long Chien申请号：US09915281申请日：20010727公开号：US098724B1公开日：20021224

专利附图：

摘要：The present invention relates to a heat dissipation device for a computer, moreparticularly relates to a heat dissipation device having a mounting structure for readilymounting a heat dissipation device onto a computer case or printed circuit board in orderto draw out the heat generated by semiconductor devices of the computer, wherein the

heat dissipation device may be mounted onto a plate of the computer case by fasteningmembers and elastic members, in addition, the heat dissipation device may directly bemounted onto a printed circuit board and connected a heat sink and a semiconductordevice to the printed circuit board for cooling the semiconductor device.

申请人：CHIEN SEN LONG

代理机构：Bacon & Thomas, PLLC

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