COPPER ELECTROLYTIC PLATING BATH AND COPPER ELECTR

专利名称：COPPER ELECTROLYTIC PLATING BATH

AND COPPER ELECTROLYTIC PLATINGMETHOD

发明人：Toshihisa Isono,Shinji Tachibana,Naoyuki

Omura,Shunsaku Hoshi

申请号：US12903555申请日：20101013

公开号：US20110089044A1公开日：20110421

专利附图：

摘要：Disclosed herein is a copper electrolytic plating bath including copper sulfate

used in an amount of 50 to 250 g/liter calculated as copper sulfate pentahydrate, 20 to200 g/liter of sulfuric acid, and 20 to 150 mg/liter of a chloride ion, and a sulfur atom-containing organic compound and a nitrogen atom-containing organic compound servingas organic additives. The nitrogen atom-containing organic compound includes a nitrogenatom-containing polymer compound obtained by a two-stage reaction including reactingone mole of morpholine with two moles of epichlorohydrin in an acidic aqueous solutionto obtain a reaction product and further reacting one to two moles, relative to one moleof the morpholine, of imidazole with the reaction product.

申请人：Toshihisa Isono,Shinji Tachibana,Naoyuki Omura,Shunsaku Hoshi

地址：Osaka JP,Osaka JP,Osaka JP,Osaka JP

国籍：JP,JP,JP,JP

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