Methods of forming conductive components and metho

专利名称：Methods of forming conductive components

and methods of forming conductive lines

发明人：Harlan H. Frankamp,Guy T. Blalock申请号：US08/953910申请日：19971020公开号：US06051502A公开日：20000418

摘要：The invention encompasses methods of forming conductive components andmethods of forming conductive lines. In one aspect, the invention includes a method offorming a conductive component comprising: a) anisotropically etching a conductivematerial into a conductive component shape having at least one sidewall, and forming anetch blocking layer over the sidewall during the anisotropic etching; and b) removing theetch blocking layer with an etchant comprising fluorine and a noble element. In anotheraspect, the invention includes a method of forming a conductive line comprising: a)forming a layer of conductive material; b) forming a masking layer over a portion of thelayer of conductive material in the shape of a conductive line; c) anisotropically etchingthe conductive material with the masking layer in place to form a conductive line beneaththe masking layer, the conductive line having sidewalls, a blocking layer forming over thesidewalls during the anisotropic etching; and d) removing the blocking layer with anetchant comprising fluorine and a noble element.

申请人：MICRON TECHNOLOGY, INC.

代理机构：Wells, St. John, Roberts, Gregory & Matkin, P

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