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2SC1212资料

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2SC1212, 2SC1212A

Silicon NPN Epitaxial

Application

Low frequency power amplifier

Outline

TO-126 MOD11. Emitter2. Collector3. Base23Absolute Maximum Ratings (Ta = 25°C)

Ratings

Item

Collector to base voltageCollector to emitter voltageEmitter to base voltageCollector current

Collector power dissipationJunction temperatureStorage temperatureNote:

1.Value at TC = 25°C

SymbolVCBOVCEOVEBOICPCPC*1TjTstg

2SC12125050410.758150–55 to +150

2SC1212A8080410.758150–55 to +150

UnitVVVAWW°C°C

2SC1212, 2SC1212A

Electrical Characteristics (Ta = 25°C)

2SC1212

Item

Collector to basebreakdown voltageCollector to emitterbreakdown voltageEmitter to basebreakdown voltageCollector cutoff current

SymbolV(BR)CBOV(BR)CEOV(BR)EBOICBOhFE

Base to emitter voltageVBECollector to emittersaturation voltageNote:B60 to 120

VCE(sat)

Min50504—6020———

Typ——————0.650.75160

Max———5200—1.01.5—

2SC1212AMin80804—6020———

Typ——————0.650.75160

Max———5200—1.01.5—

VVMHzUnitVVVµA

Test conditionsIC = 1 mA, IE = 0IC = 10 mA, RBE = ∞IE = 1 mA, IC = 0VCB = 50 V, IE = 0VCE = 4 V, IC = 50 mAVCE = 4 V, IC = 1 A(pulse test)

VCE = 4 V, IC = 50 mAIC = 1 A, IB = 0.1 A(pulse test)

VCE = 4 V, IC = 30 mA

DC current tarnsfer ratiohFE*1

Gain bandwidth productfT

1.The 2SC1212 and 2SC1212A are grouped by hFE as follows.

C

100 to 200

Maximum Collector Dissipation Curve1.0Collector power dissipation PC (W)Collector power dissipation PC (W)12Maximum Collector Dissipation Curve0.7580.540.25050100150Ambient temperature Ta (°C)200050100Case temperature TC (°C)1502

2SC1212, 2SC1212A

Typical Output Characteristics200Collector current IC (mA)16012080401.61.01.41.21.00.80.60.40.2 mAIB = 002050103040Collector to emitter voltage VCE (V)0TC = 25°CCollector current IC (A)0.80.60.40.2Typical Output Characteristics18161412108642 mAIB = 025134Collector to emitter voltage VCE (V)TC = 25°CDC Current Transfer Ratio vs.Collector Current180VCE = 4 VDC current transfer ratio hFE16014012010080600.010.02TC = 75°CCollector Current IC (A)250.31.0Typical Transfer CharacteristicsVCE = 4 V–250.10.030.051.00.20.5Collector current IC (A)1.00.0100.20.40.60.81.01.2Base to emitter voltage VBE (V)TC = –75°C25–253

元器件交易网www.cecb2b.com

8.0 ± 0.5Unit: mm

φ3.1 +0.15–0.12.7 ± 0.4°012210°5.370. 0. 0± ± 120°±0.3 .712.311.15.0 ± 6.510.82.29 ± 0.52.29 ± 0.50.551.2Hitachi CodeTO-126 ModJEDEC—EIAJ—Weight (reference value)0.67 gCautions

1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,

copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you havereceived the latest product standards or specifications before final design, purchase or use.

3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially highquality and reliability or where its failure or malfunction may directly threaten human life or cause riskof bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.

4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularlyfor maximum rating, operating supply voltage range, heat radiation characteristics, installation

conditions and other characteristics. Hitachi bears no responsibility for failure or damage when usedbeyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeablefailure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or otherconsequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.

6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document withoutwritten approval from Hitachi.

7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductorproducts.

Hitachi, Ltd.

URL

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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.

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