Electrochemical Fabrication Methods Incorporating

专利名称：Electrochemical Fabrication Methods

Incorporating Dielectric Materials and/orUsing Dielectric Substrates

发明人：Adam L. Cohen,Michael S. Lockard,Kieun

Kim,Qui T. Le,Gang Zhang,Uri Frodis,Dale S.McPherson,Dennis R. Smalley

申请号：US15358027申请日：20161121

公开号：US20170247807A1公开日：20170831

摘要：Some embodiments are directed to techniques for building single layer ormulti-layer structures on dielectric or partially dielectric substrates. Certain

embodiments deposit seed layer material directly onto substrate materials while othersuse an intervening adhesion layer material. Some embodiments use different seed layerand/or adhesion layer materials for sacrificial and structural conductive buildingmaterials. Some embodiments apply seed layer and/or adhesion layer materials in whatare effectively selective manners while others apply the materials in blanket fashion.Some embodiments remove extraneous material via planarization operations while otherembodiments remove the extraneous material via etching operations. Other

embodiments are directed to the electrochemical fabrication of multilayer mesoscale ormicroscale structures which are formed using at least one conductive structural material,at least one conductive sacrificial material, and at least one dielectric material. In someembodiments the dielectric material is a UV-curable photopolymer.

申请人：Microfabrica Inc.

地址：Van Nuys CA US

国籍：US

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